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Thermal Conductance of Graphene-Titanium Interface: A Molecular Simulation

Titanium is a commonly used material in aviation, aerospace, and military applications, due to the outstanding mechanical properties of titanium and its alloys. However, its relatively low thermal conductivity restricts its extended usage. The use of graphene as a filler shows great potential for th...

Täydet tiedot

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Bibliografiset tiedot
Päätekijät: Bingxian Ou, Junxia Yan, Qinsheng Wang, Lixin Lu
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: MDPI AG 2022-01-01
Sarja:Molecules
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Linkit:https://www.mdpi.com/1420-3049/27/3/905
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