Post-Die-Bond Defect Detection in Semiconductor Packaging AOI Under Extreme Data Scarcity: Copy-Paste Augmentation and Leakage-Aware Evaluation

In this study, we target the early-production bootstrap stage of an automatic optical inspection system, where a new inspection station or production line has started collecting data but true defect cases remain extremely scarce. We evaluated same-station defect localization at an inspection station...

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Detalles Bibliográficos

Principais autores:	Der-Fa Chen, Yanyu Lai, Chih-Chung Wang
Formato:	Artigo
Idioma:	Inglês
Publicado:	IEEE 2026-01-01
Series:	IEEE Access
Assuntos:	Semiconductor packaging automatic optical inspection low-sample learning copy-paste augmentation grouped cross-validation defect detection
Acceso en liña:	https://ieeexplore.ieee.org/document/11557303/
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