Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant

Acoustic cavitation is used for megasonic cleaning in the semiconductor industry, especially of wafers with fragile pattern structures. Control of transient cavitation is necessary to achieve high particle removal efficiency (PRE) and low pattern damage (PD). In this study, the cleaning performance...

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Bibliografski detalji

Glavni autori:	Bichitra Nanda Sahoo, So Young Han, Hyun-Tae Kim, Keita Ando, Tae-Gon Kim, Bong-Kyun Kang, Andreas Klipp, Nagendra Prasad Yerriboina, Jin-Goo Park
Format:	Artigo
Jezik:	Inglês
Izdano:	Elsevier 2022-01-01
Serija:	Ultrasonics Sonochemistry
Teme:	Megasonic cleaning Particle removal Acoustic bubble cavitation Pattern damage Dissolved gas Surfactant
Online pristup:	http://www.sciencedirect.com/science/article/pii/S1350417721004016
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