In-situ tensile analysis of microstructure evolution in Ni, Ni5W, and Ni9W using EBSD

This study systematically investigates the deformation behavior of Ni, Ni5W, and Ni9W alloys during tensile testing accompanied by electron backscatter diffraction (EBSD) analysis. During the plastic deformation stage, the loss of EBSD signals at grain boundaries is significantly influenced by the d...

Description complète

Détails bibliographiques

Auteurs principaux:	Yaotang Ji, Hongli Suo, Zhen Ma, Baoxu Huang, Jianhua Liu, Zili Zhang, Qiuliang Wang
Format:	Artigo
Langue:	Inglês
Publié:	Elsevier 2025-05-01
Collection:	Journal of Materials Research and Technology
Sujets:	In-situ tensile EBSD FCC Grain orientation Schmid factor
Accès en ligne:	http://www.sciencedirect.com/science/article/pii/S2238785425007239
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!