Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application
With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing. In this study, a SnPbSb solder with excellent wettability was use...
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| Hlavní autoři: | , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI AG
2022-11-01
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| Edice: | Crystals |
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| On-line přístup: | https://www.mdpi.com/2073-4352/12/12/1724 |
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