Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, foc...

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Główni autorzy:	Xinyue Wang, Haixue Chen, Zhoudong Yang, Wenting Liu, Zejun Zeng, Guoqi Zhang, Jing Zhang, Jiajie Fan, Pan Liu
Format:	Artigo
Język:	Inglês
Wydane:	Elsevier 2024-05-01
Seria:	Journal of Materials Research and Technology
Hasła przedmiotowe:	Cu–Ag composite sintered joints Solvent regulation Microstructure evolution Reliability test Nanoindentation measurement Power electronics packaging
Dostęp online:	http://www.sciencedirect.com/science/article/pii/S2238785424012365
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