Interdiffusion and atomic mobility in FCC Ag–Cu–Ni alloys

In the present work, the diffusion behavior of the Ag–Cu–Ni alloys was comprehensively studied for the first time. Twelve solid-solid diffusion couples were prepared and annealed at 1023, 1123, and 1223K, respectively. Based on the measured composition-distance profiles, the interdiffusion coefficie...

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Autors principals:	Juan Chen, Shuhong Liu, Qianhui Min, Shipeng Huang, Klaus W. Richter, Jieqiong Hu, Ming Xie, Yong Du
Format:	Artigo
Idioma:	Inglês
Publicat:	Elsevier 2024-03-01
Col·lecció:	Journal of Materials Research and Technology
Matèries:	Interdiffusion Atomic mobility CALTPP Ag–Cu–Ni alloy Brazing filler metals
Accés en línia:	http://www.sciencedirect.com/science/article/pii/S2238785424004010
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