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Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite

Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence of metal particles (copper and nickel), carbon-based materials (carbon nanotubes and carbon black)...

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Principais autores: Giacomo Riccucci, Lorenzo Pezzana, Simone Lantean, Alice Tori, Silvia Spriano, Marco Sangermano
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2021-06-01
coleção:Applied Sciences
Assuntos:
thermal conductivity
metallic fillers
carbon filler
ceramic fillers
silicon composites
Acesso em linha:https://www.mdpi.com/2076-3417/11/12/5663
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