Integrated through-silicon-via-based inductor design in buck converter for improved efficiency
Introduction. Through-silicon-via (TSV) is one of the most important components of 3D integrated circuits. Similar to two-dimensional circuits, the performance evaluation of 3D circuits depends on both the quality factor and inductance. Therefore, accurate TSV-inductor modeling is required for the d...
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| Auteurs principaux: | , , , , |
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| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
National Technical University "Kharkiv Polytechnic Institute"
2023-10-01
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| Collection: | Electrical engineering & Electromechanics |
| Sujets: | |
| Accès en ligne: | http://eie.khpi.edu.ua/article/view/273795/282266 |
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