A comparative study of a front opening unified pod (FOUP) moisture removal efficiency with different purging gases
Airborne molecular contamination (AMC) is one of the main causes of chip products defects during manufacturing. The downward moist air flow originated from the fan filter unit (FFU) inside the mini-environment (ME) can penetrate into the front opening unified pod (FOUP) and cause wafer defects. Purg...
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| Hauptverfasser: | , , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Elsevier
2022-11-01
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| Schriftenreihe: | International Journal of Thermofluids |
| Schlagworte: | |
| Online-Zugang: | http://www.sciencedirect.com/science/article/pii/S2666202722000623 |
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