The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure
Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration. Compared with a traditional thermoelectric device, a thin-film thermoelectric device significantly improves the cooling density and...
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| Главные авторы: | , , , , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI AG
2023-12-01
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| Серии: | Energies |
| Предметы: | |
| Online-ссылка: | https://www.mdpi.com/1996-1073/16/24/8109 |
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