Atomic insight in fusion mechanism of heterogeneous and homogeneous sintering: Cu and Ag nanoparticles
Cu and Ag nanoparticles are widely encouraged to be regarded as the die-attach material for power device packaging due to the small size effects and excellent physical properties. However, Cu nanoparticles are prone to oxidation during the sintering process, high porosity and easy electromigration o...
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| Автори: | , , , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
Elsevier
2024-02-01
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| Серія: | Results in Physics |
| Предмети: | |
| Онлайн доступ: | http://www.sciencedirect.com/science/article/pii/S2211379724000937 |
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