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Thin‐Film Assisted Laser Transfer and Bonding (TFA‐LTAB) for the Fabrication of Micro‐LED Displays

Abstract Micro‐Light Emitting Diodes (Micro‐LEDs) are key components in the field of next‐generation display technologies. In the process of making Micro‐LED displays, millions of chips need to be transferred to the driver substrate using mass transfer technology. Conventional transfer techniques, s...

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Huvudupphov: Taifu Lang, Xin Lin, Xiaowei Huang, Yujie Xie, Shuangjia Bai, Yijian Zhou, Shuaishuai Wang, Yu Lu, Xuehuang Tang, Chang Lin, Zhonghang Huang, Kaixin Zhang, Qun Yan, Jie Sun
Materialtyp: Artigo
Språk:Inglês
Utgiven: Wiley-VCH 2025-03-01
Serie:Advanced Electronic Materials
Ämnen:
bonding
micro‐LED
TFA‐LTAB
transfer
Länkar:https://doi.org/10.1002/aelm.202400380
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