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Non-destructive thickness measurement of Si wafers via optical third-harmonic generation with femtosecond laser pulses
Si wafers are vital substrate materials in semiconductor manufacturing and require precise non-destructive thickness measurements. However, the conventional electrical and optical measurement techniques are limited by depth selectivity and system complexity. Here, we propose a simple, high-precision...
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| Autori principali: | , , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Elsevier
2024-12-01
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| Serie: | Results in Optics |
| Soggetti: | |
| Accesso online: | http://www.sciencedirect.com/science/article/pii/S2666950124001524 |
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