Methods and mechanisms of gettering of silicon structures in the production of integrated circuits
Increasing the degree of integration of hardware components imposes more stringent requirements for the reduction of the concentration of contaminants and oxidation stacking faults in the original silicon wafers with its preservation in the IC manufacturing process cycle. This causes high relevance...
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| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Politekhperiodika
2013-06-01
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| coleção: | Технологія та конструювання в електронній апаратурі |
| Assuntos: | |
| Acesso em linha: | https://tkea.com.ua/index.php/journal/article/view/393 |
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