A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages
This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to fu...
Kaydedildi:
| Yazar: | |
|---|---|
| Materyal Türü: | Artigo |
| Dil: | Inglês |
| Baskı/Yayın Bilgisi: |
Wiley
2016-01-01
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| Seri Bilgileri: | International Journal of Antennas and Propagation |
| Online Erişim: | http://dx.doi.org/10.1155/2016/9562854 |
| Etiketler: |
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