Atomic-scale study of Cu3Sn and Cu6Sn5 intermetallic layers growth after soldering
Advanced microscopy and elemental analysis techniques were employed to investigate the atomic-scale characteristics of intermetallic compound (IMC) layers of Cu3Sn and Cu6Sn5, which commonly form on copper-based surfaces during reflow soldering with lead-free Sn-based alloys in electronic packaging...
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| Hauptverfasser: | , , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Elsevier
2026-06-01
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| Schriftenreihe: | Materials & Design |
| Schlagworte: | |
| Online-Zugang: | http://www.sciencedirect.com/science/article/pii/S0264127526007367 |
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