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Effect of sodium 3,3'-dithiodipropane sulfonate in a dual-ligand electroless copper system

The process of electroless copper plating in an EDTA/THPED dual-ligand system using sodium 3,3'-dithiodipropane sulfonate (SPS) as an additive was studied by the electrochemical method. The mixed potential of the system was measured as a function of time, and results indicate that addition of SPS gr...

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Principais autores: LU Jian-hong, JIAO Han-dong, JIAO Shu-qiang
Format: Artigo
Sprog:Chinês
Udgivet: Science Press 2017-09-01
Serier:工程科学学报
Fag:
sodium 3,3'-dithiodipropane sulfonate
electroless copper
ligand
mixed potential
liner sweep voltammetry
preferred orientation
Online adgang:http://cje.ustb.edu.cn/article/doi/10.13374/j.issn2095-9389.2017.09.011
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