Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...
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| Hlavní autoři: | , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
Gruppo Italiano Frattura
2011-01-01
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| Edice: | Fracture and Structural Integrity |
| Témata: | |
| On-line přístup: | http://www.gruppofrattura.it/pdf/rivista/numero15/numero_15_art_7.pdf |
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