Hardware design of high-performance computing systems with enhanced heat dissipation efficiency
Schemes of basic supporting structures for powerful supercomputers with water cooling, containing heat pipe collectors in the heat transfer path, have been developed and studied. This made it possible to remove up to 24,500 W of heat from a single equipment cabinet, significantly reduce the hydrauli...
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
Politekhperiodika
2005-10-01
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| Colección: | Технологія та конструювання в електронній апаратурі |
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| Acceso en línea: | https://tkea.com.ua/index.php/journal/article/view/1018 |
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