Fabrication, Thermal Conductivity, and Mechanical Properties of Hexagonal-Boron-Nitride-Pattern-Embedded Aluminum Oxide Composites
As electronics become more portable and compact, the demand for high-performance thermally conductive composites is increasing. Given that the thermal conductivity correlates with the content of thermally conductive fillers, it is important to fabricate composites with high filler loading. However,...
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| Autors principals: | , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2022-08-01
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| Col·lecció: | Nanomaterials |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2079-4991/12/16/2815 |
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