Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, multilayered structures with through-silicon vias connection, and silicon photonic...

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Detalhes bibliográficos
Main Authors: Aleksandr Andreevich Vlasov, Topi Uusitalo, Heikki Virtanen, Jukka Viheriala, Mircea Guina
Formato: Artigo
Idioma:Inglês
Publicado em: IEEE 2023-01-01
Colecção:IEEE Photonics Journal
Assuntos:
Assembly processes
infrared imaging
infrared microscopy
laser-assisted bonding
photonic integration
silicon devices
Acesso em linha:https://ieeexplore.ieee.org/document/10210034/
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