Impact of Thermal Annealing on the Dissolution of Semiconducting Polymer Thin Films

Abstract Here, the effect of thermal annealing (TA) on the stability of solution‐sheared thin films of the semiconducting polymer poly[2,5‐bis(2‐octyldodecyl)pyrrolo[3,4‐c]pyrrole‐1,4(2H,5H)‐dione‐3,6‐diyl)‐alt‐(2,2′;5′,2′’;5′’,2′’’‐quaterthiophen‐5,5′’’‐diyl)] (PDPP4T) against the original coating...

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Detalhes bibliográficos

Principais autores:	Shaoling Bai, Katherina Haase, Jonathan Perez Andrade, Mike Hambsch, Felix Talnack, Vojtech Millek, Anupam Prasoon, Jinxin Liu, Kerstin Arnhold, Susanne Boye, Xinliang Feng, Stefan C. B. Mannsfeld
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Wiley-VCH 2024-07-01
Colecção:	Advanced Electronic Materials
Assuntos:	multi‐layer deposition OFETs, polymer semiconductor sequential solution process thermal annealing thermal cross‐linking
Acesso em linha:	https://doi.org/10.1002/aelm.202300801
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