Tribological, mechanical and thermal response of diamond micro-particles reinforced copper matrix composites fabricated by powder metallurgy
Copper/Diamond composites have gained a lot of attention in recent years due to their excellent thermal conductivity and their potential for use in high-power electronic devices. The current work targets on an experimental investigation of the tribological,mechanical, and thermal behaviour of copper...
Bewaard in:
| Hoofdauteurs: | , , , |
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| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
IOP Publishing
2023-01-01
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| Reeks: | Materials Research Express |
| Onderwerpen: | |
| Online toegang: | https://doi.org/10.1088/2053-1591/acb1a0 |
| Tags: |
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