Design and Key Technologies of High-power Press-pack IGBT Device
It presented the advantages of high-power press-pack IGBT device with respect to conventional soldering device. In the aspect of device design, insulation and blocking failure mechanism were analyzed as well as optimized solution which increasing the dielectric strength of contacting media. Influen...
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| Principais autores: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Chinês |
| Publicado em: |
Editorial Office of Control and Information Technology
2016-01-01
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| coleção: | Kongzhi Yu Xinxi Jishu |
| Assuntos: | |
| Acesso em linha: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.02.005 |
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