Cryogenic-enhanced HDI hardening in a heterostructured Cu-Sn alloy for strength-ductility-conductivity synergy

Achieving a superior balance of strength, ductility, and electrical conductivity remains challenging in Cu alloys because conventional strengthening strategies usually sacrifice one or more of these properties. Here, a heterostructured Cu-Sn alloy was fabricated by dynamic offsets and shear force ad...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Xin Xue, Longfei Xu, Yifei Xu, Renhao Wu, Xiaoman Chen, Heng Li, Yuhui Wang, Hyoung Seop Kim
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	Taylor & Francis Group 2026-08-01
Sarja:	Materials Research Letters
Aiheet:	Cu-0.1Sn alloy mechanical properties ductility electrical conductivity cryogenic deformation
Linkit:	https://www.tandfonline.com/doi/10.1080/21663831.2026.2679190
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