Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED
The die-bonding layer between chips and substrate determinates the heat conduction efficiency of high-power LED. Sn-based solder, AuSn20 eutectic, and nano-Ag paste were widely applied to LED interconnection. In this paper, the optical–thermal performances and high-temperature reliability of LED wit...
Sábháilte in:
| Príomhchruthaitheoirí: | , , , , , |
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| Formáid: | Artigo |
| Teanga: | Inglês |
| Foilsithe / Cruthaithe: |
MDPI AG
2022-06-01
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| Sraith: | Micromachines |
| Ábhair: | |
| Rochtain ar líne: | https://www.mdpi.com/2072-666X/13/6/958 |
| Clibeanna: |
Níl clibeanna ann, Bí ar an gcéad duine le clib a chur leis an taifead seo!
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