Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Compari...

Cijeli opis

Bibliografski detalji

Glavni autori:	Che-Hsuan Huang, Chieh-Yu Kang, Shu-Hsiu Chang, Chih-Hao Lin, Chun-Yu Lin, Tingzhu Wu, Chin-Wei Sher, Chien-Chung Lin, Po-Tsung Lee, Hao-Chung Kuo
Format:	Artigo
Jezik:	Inglês
Izdano:	MDPI AG 2019-04-01
Serija:	Crystals
Teme:	chip scale package freeform design mini LED light emitting diode
Online pristup:	https://www.mdpi.com/2073-4352/9/4/202
Oznake:	Dodaj oznaku Bez oznaka, Budi prvi tko označuje ovaj zapis!