Low-temperature crosslinked soluble polyimide as a dielectric for organic thin-film transistors: enhanced electrical stability and performance

We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytet...

Полное описание

Библиографические подробности

Главные авторы:	Sungmi Yoo, Kyeongmin Kim, Cho Long Kim, Seong Hun Choi, Jong Chan Won, Taek Ahn, Yun Ho Kim
Формат:	Artigo
Язык:	Inglês
Опубликовано:	IOP Publishing 2024-01-01
Серии:	JPhys Materials
Предметы:	polymer dielectric polyimide cross-linking network mobility thin-film transistors
Online-ссылка:	https://doi.org/10.1088/2515-7639/ad1ea0
Метки:	Добавить метку Нет меток, Требуется 1-ая метка записи!