Enhanced electronic cooling with optimized metal foam/PCM composite heat sinks: A numerical study
The current study numerically investigates the thermal performance and optimization of metal foam (MF) heat sinks for electronic cooling applications. Key design parameters include different types of phase change material (PCM) (RT31, RT42, RT55), MF porosity (0.1–95 %), MF material (aluminum, coppe...
Enregistré dans:
| Auteurs principaux: | , , |
|---|---|
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
Elsevier
2025-11-01
|
| Collection: | International Journal of Thermofluids |
| Sujets: | |
| Accès en ligne: | http://www.sciencedirect.com/science/article/pii/S2666202725004574 |
| Tags: |
Pas de tags, Soyez le premier à ajouter un tag!
|
