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Enhanced electronic cooling with optimized metal foam/PCM composite heat sinks: A numerical study

The current study numerically investigates the thermal performance and optimization of metal foam (MF) heat sinks for electronic cooling applications. Key design parameters include different types of phase change material (PCM) (RT31, RT42, RT55), MF porosity (0.1–95 %), MF material (aluminum, coppe...

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Auteurs principaux: Muhammad Ahmad, Mohammad O. Hamdan, Bassam A. Abu-Nabah
Format: Artigo
Langue:Inglês
Publié: Elsevier 2025-11-01
Collection:International Journal of Thermofluids
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Accès en ligne:http://www.sciencedirect.com/science/article/pii/S2666202725004574
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