Simulation study of cutting fluid flow field in kerf of fine diameter diamond wire saw
Objectives: Electroplated diamond wire saws are widely used in the field of slicing hard and brittle materials such as monocrystalline silicon and sapphire. Cutting fluid should give full play to its role in the sawing process, which is conducive to the improvement of wafer quality. As the size of t...
Tallennettuna:
| Päätekijät: | , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Chinês |
| Julkaistu: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2024-12-01
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| Sarja: | Jin'gangshi yu moliao moju gongcheng |
| Aiheet: | |
| Linkit: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0235 |
| Tagit: |
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