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Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification

The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructura...

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Principais autores: Ulla Hauf, Alexander Kauffmann, Sandra Kauffmann-Weiss, Alexander Feilbach, Mike Boening, Frank E. H. Mueller, Volker Hinrichsen, Martin Heilmaier
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2017-11-01
Colecção:Metals
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Acesso em linha:https://www.mdpi.com/2075-4701/7/11/478
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