Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification
The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructura...
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| Principais autores: | , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2017-11-01
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| Colecção: | Metals |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2075-4701/7/11/478 |
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