Thinning technology of MgO substrate for diamond growth by laser slicing
We tried laser slicing of (100) MgO wafer used as a substrate for heteroepitaxial growth of single crystal diamond. The laser slicing was successful by irradiating the inside of the material with an ultrashort pulse laser and generating a {100} cleavage. However, it was clarified that the cleavage o...
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| Główni autorzy: | , , , |
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| Format: | Artigo |
| Język: | Japonês |
| Wydane: |
The Japan Society of Mechanical Engineers
2021-03-01
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| Seria: | Nihon Kikai Gakkai ronbunshu |
| Hasła przedmiotowe: | |
| Dostęp online: | https://www.jstage.jst.go.jp/article/transjsme/87/896/87_21-00022/_pdf/-char/en |
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