Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder alloys in a corrosive environment via scanning electron micr...
Tallennettuna:
| Päätekijät: | , , , , , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
Elsevier
2022-09-01
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| Sarja: | Journal of Materials Research and Technology |
| Aiheet: | |
| Linkit: | http://www.sciencedirect.com/science/article/pii/S2238785422014053 |
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