Process research on ultrasonic vibration assisted lapping of single crystal silicon carbide
Aimming at the problems such as low material removal rate and abrasive agglomeration when polishing single crystal silicon carbide wafers with traditional methods, this study proposed a ultrasonic vibration assisted lapping method. It studied the influence of different process parameters including s...
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| Autori principali: | , , , |
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| Natura: | Artigo |
| Lingua: | Chinês |
| Pubblicazione: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2022-06-01
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| Serie: | Jin'gangshi yu moliao moju gongcheng |
| Soggetti: | |
| Accesso online: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2021.0208 |
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