Effect of halogen-free direct coating process on free air ball morphology of palladium-coated copper wire
The characteristics of palladium layer on the surface of copper wire are important factors affecting the quality of free air ball （FAB） and bonding during chip packaging. In this paper， palladium-coated copper wires with different coating speeds and coating temperatures are prepared by halogen-free...
Gorde:
| Egile Nagusiak: | , , , , , , |
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| Formatua: | Artigo |
| Hizkuntza: | Chinês |
| Argitaratua: |
Journal of Materials Engineering
2026-03-01
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| Saila: | Cailiao gongcheng |
| Gaiak: | |
| Sarrera elektronikoa: | https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000829 |
| Etiketak: |
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