Polymer‐based nanocomposites in semiconductor packaging
Abstract Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, p...
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| Autors principals: | , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Wiley
2023-09-01
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| Col·lecció: | IET Nanodielectrics |
| Matèries: | |
| Accés en línia: | https://doi.org/10.1049/nde2.12050 |
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