Inverse Lithography Technology (ILT) Under Chip Manufacture Context
As semiconductor process nodes shrink to 3 nm and beyond, traditional optical proximity correction (OPC) and resolution enhancement technologies (RETs) can no longer meet the high patterning precision needs of advanced chip manufacturing due to the sub-wavelength lithography limits. Inverse lithogra...
Na minha lista:
| Principais autores: | , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2026-01-01
|
| coleção: | Micromachines |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2072-666X/17/1/117 |
| Tags: |
Sem tags, seja o primeiro a adicionar uma tag!
|