Efficient foam-based thermal interface material functionalized with MWCNTs for CPU cooling applications: thermal performance modeling and Experimental studies
Abstract Efficient thermal dissipation remains one of the foremost challenges in modern electronics, as excessive heat can critically damage device performance and reliability. In this work, we introduce a novel thermal interface material (TIM) based on polyvinyl-formaldehyde (PVF) foam functionaliz...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Portfolio
2026-03-01
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| coleção: | Scientific Reports |
| Assuntos: | |
| Acesso em linha: | https://doi.org/10.1038/s41598-026-41260-5 |
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