Deformation patterns and coordination mechanisms of cross-size microchannels during thermocompression bonding process

High-quality bonding of microfluidic chips is essential for driving the rapid marketization of microfluidic devices. While thermocompression bonding is known for its simplicity, challenges such as high deformation and low bond strength persist. In this paper, we conducted micro-scale compression cre...

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Bibliografische Detailangaben

Hauptverfasser:	Baishun Zhao, Fan Mo, Wangqing Wu, Bingyan Jiang, Gerhard Ziegmann
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	Elsevier 2023-09-01
Schriftenreihe:	Journal of Materials Research and Technology
Schlagworte:	Microfluidic chips Thermocompression bonding Compression creep model Microchannel deformation compensation Cross-size microchannel coordination
Online-Zugang:	http://www.sciencedirect.com/science/article/pii/S2238785423019543
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