Grain refinement and pinning effect by SiC nanowires enhance the thermal reliability of sintered Ag joints for power electronics
The influence of 0.07 wt% SiC nanowires (SiC NWs) addition on the microstructure, mechanical properties and crystallographic behaviors in sintered Ag joint during thermal aging at 300 °C for various durations has been investigated. The experimental results reveal that the shear strength of sintered...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2026-03-01
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| Col·lecció: | Journal of Materials Research and Technology |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2238785426005806 |
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