Silicon carbide nanowire-reinforced micro-Ag joint based on pinning effect for power electronics packaging
Low-temperature sintering Ag technology is a feasible approach employed in power electron devices. In this study, the influence of the different amounts (0, 0.03, 0.05, 0.07, 0.10, 0.20 wt%) of silicon carbide nanowires (SiC NWs) on the properties and microstructure of micro-Ag paste sintered at 250...
Na minha lista:
| Principais autores: | , , , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Elsevier
2024-11-01
|
| coleção: | Materials & Design |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S0264127524007391 |
| Tags: |
Sem tags, seja o primeiro a adicionar uma tag!
|