Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes
Here, we report a novel technology for the fabrication of copper-electroplating-modified liquid metal microelectrodes. This technology overcomes the complexity of the traditional fabrication of sidewall solid metal electrodes and successfully fabricates a pair of tiny stable solid-contact microelect...
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| Principais autores: | , , , , |
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| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
MDPI AG
2022-02-01
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| 叢編: | Sensors |
| 主題: | |
| 在線閱讀: | https://www.mdpi.com/1424-8220/22/5/1820 |
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