Stamping Lithography on Arbitrary Surfaces based on Self‐Assembly of Colloidal Particles

Abstract Three‐dimensional (3D) circuits on curved surfaces have been widely used in conformal antennas, intelligent skins, metasurfaces, and bionic electronics. Traditional planar circuit technologies represented by photolithography are confronted with the problem of being difficult to apply to cur...

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Autors principals:	Guoxu Yu, Heyang Zhang, Yiming Li, Lele Song, Jinglin Jia, Lei Chen, Ding Weng, Yuan Ma, Jiadao Wang
Format:	Artigo
Idioma:	Inglês
Publicat:	Wiley 2026-02-01
Col·lecció:	Advanced Science
Matèries:	3D circuits micro/nano manufacturing self‐assembly soft lithography
Accés en línia:	https://doi.org/10.1002/advs.202518380
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