Thermal Performance of Hollow Fluid-Filled Heat Sinks
The increasing power density of electronic devices drives the need for lighter, more compact heat dissipation devices. This research determines whether a hollow heat sink filled with fluid outperforms solid heat sinks for heat dissipation. Research on the integration of a heat spreader, heat pipe, a...
I tiakina i:
| Ngā kaituhi matua: | , , , |
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| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
MDPI AG
2025-03-01
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| Rangatū: | Energies |
| Ngā marau: | |
| Urunga tuihono: | https://www.mdpi.com/1996-1073/18/7/1564 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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