Improving bonding strength and reliability of brazed titanium/copper dissimilar joint using vanadium interlayer
Conventional practice of brazing titanium (Ti) to copper (Cu) using Ag-28Cu eutectic filler alloy is of limited success because of the generation of brittle Ti-Cu intermetallic compounds (IMCs). The bonding strength is unsatisfactory owing to embrittlement of IMCs, and it is difficult to reproduce t...
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| Autors principals: | , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
IOP Publishing
2023-01-01
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| Col·lecció: | Materials Research Express |
| Matèries: | |
| Accés en línia: | https://doi.org/10.1088/2053-1591/ad146e |
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