A Dynamic Physics-Guided Ensemble Model for Non-Intrusive Bond Wire Health Monitoring in IGBTs

Bond wire degradation represents the predominant failure mechanism in IGBT modules, accounting for approximately 70% of power converter failures and posing significant reliability challenges in modern power electronic systems. Existing monitoring techniques face inherent trade-offs between measureme...

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Principais autores:	Xinyi Yang, Zhen Hu, Yizhi Bo, Tao Shi, Man Cui
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2026-01-01
Colecção:	Micromachines
Assuntos:	IGBT health monitoring bond wire degradation ensemble learning physics-constrained machine learning
Acesso em linha:	https://www.mdpi.com/2072-666X/17/1/70
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