Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a high microhardness of 2.1 GPa. The structure coarseni...

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Principais autores:	Jianxin Hou, Xiuyan Li, Ke Lu
פורמט:	Artigo
שפה:	Inglês
יצא לאור:	MDPI AG 2021-08-01
סדרה:	Nanomaterials
נושאים:	nanolaminated structure deformation mechanism low angle grain boundaries thermal stability copper
גישה מקוונת:	https://www.mdpi.com/2079-4991/11/9/2252
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