Effect of double-sided polishing on surface morphology of quartz mask blanks
ObjectivesAs the critical dimensions in integrated circuit structures continue to shrink, transistor density and chip performance keep improving. At the same time, the continuous evolution of integrated circuit manufacturing processes increasingly demands stricter flatness requirements for mask blan...
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| Auteurs principaux: | , , |
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| Format: | Artigo |
| Langue: | Chinês |
| Publié: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2025-08-01
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| Collection: | Jin'gangshi yu moliao moju gongcheng |
| Sujets: | |
| Accès en ligne: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2024.0161 |
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