3D-printed facet-attached microlenses for advanced photonic system assembly

Wafer-level mass production of photonic integrated circuits (PIC) has become a technological mainstay in the field of optics and photonics, enabling many novel and disrupting a wide range of existing applications. However, scalable photonic packaging and system assembly still represents a major chal...

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Główni autorzy:	Yilin Xu, Pascal Maier, Mareike Trappen, Philipp-Immanuel Dietrich, Matthias Blaicher, Rokas Jutas, Achim Weber, Torben Kind, Colin Dankwart, Jens Stephan, Andreas Steffan, Amin Abbasi, Padraic Morrissey, Kamil Gradkowski, Brian Kelly, Peter O’Brien, Wolfgang Freude, Christian Koos
Format:	Artigo
Język:	Inglês
Wydane:	Light Publishing Group 2023-11-01
Seria:	Light: Advanced Manufacturing
Hasła przedmiotowe:	photonic integration photonic assembly photonic packaging additive laser manufacturing multi-photon lithography facet-attached microlenses optical alignment tolerances fiber-chip coupling hybrid multi-chip modules
Dostęp online:	https://www.light-am.com/article/doi/10.37188/lam.2023.003
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